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IX2R11
Absolute Maximum Ratings*
Package power dissipation@ T CASE ≤ 25 C
C/W
C/W
Symbol
V CH
V HS
V HGO
V CL
V LGO
V DD
V DG
V IN
dV HS /dt
P D
P D
R THJA
R THJC
Definition
High side floating supply voltage
High side floating supply offset voltage
High side floating output voltage
Low side fixed supply voltage
Low side output voltage
Logic supply voltage
Logic supply offset voltage
Logic input voltage(HIN, LIN, ENB)
Allowable offset supply voltage transient
Package power dissipation@ T AMBIENT ≤ 25 o C
o
Thermal resistance, junction-to-ambient
Thermal resistance, junction-to-case
Min
-0.3
-200
V HS - 0.3
-0.3
-0.3
-0.3
V LS - 1
V LS - 0.3
---
---
---
---
---
Max
+ 35
+500
V CH + 0.3
+35
V CL + 0.3
V CL + 0.3
V LS + 1
V CL + 0.3
50
1.25
2.5
100
50
Units
V
V
V
V
V
V
V
V
V/ns
W
W
o
o
T J
T S
T L
Junction Temperature
Storage temperature
Lead temperature (soldering, 10 secs.)
---
-55
---
150
150
300
o
o
o
C
C
C
Recommended Operating Conditions
C
Symbol
V CH
V HS
V HGO
V CL
V LGO
V DD
V DG
V IN
T A
Definition
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Low side fixed supply voltage
Low side output voltage
Logic supply voltage
Logic supply offset voltage
Logic input voltage(HIN, LIN, ENB)
Ambient Temperature
Min
V HS +10
-250
V HS
10
0
V DG +3
V LS -0.3
V DG
-40
Max
V HS +20
+500
V HS +V CH
20
V CL
V DG +V CL
V LS +0.3
V DD
125
Units
V
V
V
V
V
V
V
V
o
*Note: Operating the device beyond parameters with listed “absolute maximum ratings” may cause permanent
damage to the device. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.
? 2007 IXYS CORPORATION All rights reserved
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